地点：中心三楼1347
Hongtao Ma 博士简历
PROFILE
• Industry recognized expert and leader in the reliability and implementation of lead-free electronics.
• 13 + years research and development experience in academic and industry environment.
• 8 + years research experience in advanced electronic packaging and lead-free electronics technology.
• 2 years hands on experience with microelectronic design and fabrication process.
• 3 years as materials research engineer and technical leader.
EDUCATION
Ph.D. Electrical and Computer Engineering, Auburn University, Auburn, AL Dec. 2006
(Completed degree in Dec. 2006, degree awarded officially in May 2007)
M.B.A. Auburn University, Auburn, AL Dec. 2006
M.S. Materials Science and Engineering, Auburn University, Auburn, AL May 2002
B.S. Materials Science and Engineering, Xi’an Jiaotong University, Xi’an, China July 1997
PROFESSIONAL EXPERIENCE
CISCO SYSTEMS, INC., San Jose, CA
Packaging Reliability Engineer Nov. 2007– Present
• Lead lead-free electronics conversion strategy and technology assessment projects.
• Lead multiple cross-functional projects and teams in reliability of lead-free electronics across all Cisco products families.
• Lead advanced packaging technology initiatives in Flip-chip, WLCSP, TSV, SIP and other 3D integrations.
